HomeMy WebLinkAboutPermit Correspondence 1984-01-03SiPRINGFTELD
CITY OF SPRINGFIELD
Fire Prevention Bureau
Building Division
Mr. Bob Peterson
c/o Stellar Vision
402 Shelley Street
Springf,ield, Oregon
January 3, 1984
97 477
1
2
3
RE: Circuit Board Production Requirements
Dear I{r. Peterson:
A joint review of your proposed circuit board production activities has been conducteC
by the City Building Safety Division, Fire Prevention Department and the Department of
Environrnental Affairs. The following requirements are deemed applicable to the safe
storage, use and disposal of the chemicals utilized in your electroplating and etching
processes.
STORAGE OF CHET,IICALS
The Uniforn Fire Code requires the following provisions relative to the storage of
potentialLy hazardous chemicals :
Oxidizing materials shal1 be stored in coo1, ventilated, dry location and separated
from organic materials. BuIk oxidizing materials shall not be stored on or against
combustible surfaces.
Corrosive liquids shal1 be stored in cool, ventilated, dry location and protected
against physicat damage and water, separate from oxidizing and combustible materials.
Inside storage of chemicals shall be limited to quantities needed for process opera-
tion. Bulk storage is not allowed unless Code provisions for bulk or Hi-Pi1e storage
are met.
4. Chemicals shall not be stored in any way that would block an exit path or exit door.
5. If the storage of oxidizing and comosive naterials cannot be separated far enough
. to satisfy all Code requirements, partition walls sha11 be required for separation.
Coordinate the above listed requirements with Mike Hudman of the City Fire Marshals office.
Please'direct all inquiries regarding chemcial storage to the Springfield Fire Prevention
Department at 726-3737 .
USE OF CHEMICALS
A product-conveying ventilation system, designed in compliance with Chapter 11 of the
Mechanical Specialty Code and Mechanical Fire and Life Safety Code, shal1 be provided
above the polypropolene vats utilized in the electroplating and etching process. The
hood and duct system shall be protected with suitable corrosion-resistant material as
L
225 North 5th Street o Springfield, Oregong7477 . 503/726-3753, 503/726-3737
Ivlr. Bob Peterson
Circuit Board Production Requirements
January 3, 1984
Page 2.
)
recluired for Class 5 systems conveying corrosives, such as acid vapors. Coordi-
nate ventilation requirements with the City Mechanical Inspector.
Due to the potential for back siphonage or cross connections which could contami-
nate the potable water system, a reduced-pressure backflow prevention device will
be required on the water service to the.:chemical use area of the building. Coor-
dinate water service protection requirements with Tim Hanley of the Rainbow Water
District and with the City Plumbing Inspector.
A separate letter will be sent to you from the Rainbow Water District regarding
water service protection.
The area where hazardous chemicals are handled, transfered or used shal1 be pro-
vided with an approved floor and wal1 surface which is not adversely affected by
the chemicals being used. This area shall be sloped, curbed or otherwise designed
in a manner capable of safely containing any accidential spillage or leakage which
could occur until "c1ean-up" operations could be performed.
Care shal1 be taken in the design and construction of the hazardous chemical con-
tainment area to assure that the City wastewater system is protected from the pos-
sibility of accidential discharge of prohibited chemicals into the systen. A sep-
arate letter will be sent to you from the Department of Environnental Affairs re-
garding prohibited contaminants of the wastewater system.
Alteration or extension of electrical circuitry requires an electrical permit and
inspections. State of 0regon Administrative Rules require that all electrical
wiring on properties for rent, sale or lease be performed by an 0regon licensed
electrical contractor. Coordinate specific requirements for electrical work with
the City Electrical Inspector.
Please direct all inquiries regarding building, mechanical, plumbing or electrical
requirements with the City Building Safety Division at 726-3753.
Sincerely,
3
4
/**-r-e/7-4*?-?Lorne W. Pleger l'{ichael Hudman
Acting Fire }{arshalSenior Plans Examiner
LP:MH/lh
RAINBOW
WATER
DISTRICT
-"Prtnulltl
\?tLtitlll Nttth anrl Wtsl SprineliL'ltl
January 4, .l984
Stel Iar Vision
1 I 44 Gateway LoopSpringfield,0R 97477Attn: Bob Peterson
Dear Mr. Peterson,
.I'm.writing'in reference to our-meeting of December 28, 1983 regarding your proposedcircuit board process, at 402 Shelley Stieet in Springfiitd. In ieviewin! tne'pro-posed manufacturing at your facility, the chemicals uied and the possibility of'back-flow of those chemicals into the potdble water system were considlred. trle loncludedthat reduced pressure principle backflow prevention device(s) (RP) mrst be iniialleAto protect both processing vats and the janitor sink from contaminating the potablewater supply. There have been numerous instances throughout the countiy wherecontaminated liquids have been siphoned into the water iystem through fixtures similarto those at your facility. As the water purveyor, it i.s our responiiuility Co insurethat suchanaccident does not occur. Before your plunbir instalis any fixiures in thebujld'ing for you, p'lease have him contact our office so he can be inf6rmed of ourrequirernnts regarding the type of backflow device or devices needed to be installed.
Upon installation of the device(s) and annually thereafter, a test of the unit(s)must be performed by a certified backflow prevention tester io insure that the devicejs workjng properly. Enc'losed is a list of certified testers in the a.ea. (Ani ofthese individua'ls may also be able to assist you in the proper installation df inedevice.) I{e request to be notified when the test is to be'made in order for one oforrr !epresentatives to be present during the test.
, Upon the successful testing of the devicer a copy of the test report should be keptfor your files. A duplicate copy should be furnis-hed to us by the tester for ourrecords. _Your prompt attention in this matter will help insure the continuation of asafe, public drinking water supply for all and preclude'the Rainbow trlater Districtfrom taking further steps to protect the public water system.
If you should have any questions, please feel free to call 746-1616.
Sincerely.
F-- ,/'1-/.r( rutx_-/
Ted Roos
Asst. Superintendent
c.c. Chuck Davis
Springf ield Uti1 ity Board
-1550
N.42nd St. ' P.O. Box 8. Springfield, OR97477 o 5O3lT46-1676
**f,ff./ I / -d-'
--::= iI , t! ! )rL,:t v
---'j-Jj'
, t.t -,xl .l:'fi,ii:=I I g'-.r'I.i ,l:EJ J*-"1''li;*-,- *
December 2L' 1983
Mr. GregorY-S' I'lott
q ii?ilit ti'll?iifu ilE "?"
n'r'Lmen'L
6;it';;il'ri]-6i"s'o" e7 417
RE: StellarVision International Operations aL l.]-44 Gateway
r\r: ' i;;p, sPr ingf ield ' oregon
Dear Mr. Nlott:
StellarVision -produges-119 markets computer controlled infor-
marion and vidbo enrertri"#;;"I,"t"*"' f;;- Larger hotels'
WeoccuPysPacetosatisfytheneedsofsales,administration'
research & developmgnr,,proi.r"r prototyp;-;;a initial produc-
rion. rhe "i;;;it board- p;;;;;vi ? :"|"''['oa""tion activities
require rhe i;;;;"oI-iro-tzj to- iour (4) people in space
equivalen*l'il"""it,r"- 5i- of. the current' compatty needs '
TheplocessofcreatingcircuitboardswithmetalPlated
rhrough the !q!es' from t;;";i;"-oi'tt'e"iI"tJ-to tfi6-6TEer'
Tn?Iffies pasE6g-rhe. 1"*i.,I.I**I..iia1 . thiough several chemi-
ca1 barhs, ,or.u; washings;';i";;;oprrtt"g and etching processes '
All of rhe chemicals are ionlui""d^in polyptopolene vats' As
EEe solutions are weak"rrui-tfrio',rgf't use,-ci'lrnilals a.e added'
Copper ana.oiter roxics ,i""iiriafi"*p"a to plastic containers'
when solurlons become ,rn ilf.r[f.i ,ira ,i" ioutinely shipped to
iiru--".PP1 ier f or disPos al '
Attachedalesolutionformulae,processcycles,andtechnical;;;;;;- icopies) from the suPPlier'
Iamavailablea:-T26-115lanytimetoanswerquestionswhich
mighr arise regarding our processes'
SincerelY,
Robert R. Peterson
Purchasing Direetor
RRP,/ 7 k
srELUSlVtstoN
,144 GATEWAY LOOP SPRIN(?F/ELD, )REGON s7477 68) 726-t/51
CYCLE TIME
3-5 Minutes
1 minute
1 minute
5 minutes
3 minutes
3 minutes
20 minutes
NOTE
Water Break
S hlmon, iMatt
Copper matt
Dark Color Holes
"Titty" Pink
Coverage in Holes
1.
2.
3.
4.
5.
6.
7.
8.
9.
i0.
11.
12.
13.
14.
15.
16.
17.
18.
19.
20.
2t.
Ad Clean 6A
Rinse
Rinse
Peroxy Etch 63
Rinse
Rinse
1% H"504L
Rinse
Rinse
Predip 555
Car- 555
Drag
Rinse
Rinse
Accelator AC-3
Rinse
Rinse
Elecrroless Copper
White Foam
Dr ag
Rinse
Rinse
708
1
2
PTli Ll NE ( Tank Vo lume 4 .33 @ 1 2 " )
Ad clean 6A i0% bY volume
Peroxy Etch 63
6% by volume
H2504
H?504 10%
I'rcdip 555
Cat 555
Prc.dip 555
Cat.
Make -Up
7 cups
l quart
7 .5 cups
2 quart.s
i0 lbs
10 1bs
2.5 cups
314 fu11 HZO
3 quar t-s
cups
cups
Balance
H 0Z
H 0
3
4
C)
H 0
,)
2
2.
2H
H 0
6
l
8
Dr ag
AC-3
Elcctrolle-ss Cu 708
7 08A
7088
Hzo
iI20
1l
A
.5.5
5.5
0
0d s1owlye
9. Drag 314 fuI1 H 02
E1 ectro 1at i Section Chemicals
Copper Sulphate:
+ 20% Sulphuric Acid (By Volume)
- 6 oz.lGallon Copper Sulphate
- Balance HZO
AC Cleaner ll5 ( See Tech. Sheet )
107. Sulphuric Acid Solution
Stanis Sulphate
- 15% Sulphuric Acid (By Volume)
- 4 oz.lGallon Tin Sulphate
- Balance HZO
-\
TECHNICAL DATA SHEET
ADGLEAN 6A
INE
There's always a Chemtine solution
GENERAL DESCRIPTION
Alkaline cleaning has long been the standard of the
metal f inishing industry. No other cleaner otfers the
economy and capacity ol alkaline, hot soak,
cleaning. The circuit board industry, since its incep-
tion, has depended on alkaline cleaning, and
Chemline's Adclean 6A fulfills this requirement.
A 10 ml sample is removed from the production bath
and transferred to a 250 or 500 ml flask. Dilute with
100 ml deionized water, add 3 or 4 drops phenoph-
thalein indicator and titrate to a clear endpoint with
0.1 N acid.
A new 9:'l bath will titrate to 21-22 ml. Use the chart
below to maintain a 9;1 dilution strength.
APPLICATION INFORMATION
Adclean 6A is designed to remove light soils, finger-
prints and tarnish lrom copper laminate. lt can be
used prior to electroless copper or plating.Titre in ml Addition in ml per
gallon of productlon bath
60
95
131
166
203
237
275
BATH MAKE-UP
'I part Adclean 64
9 parts water (Dl preferred)
18.0
16.0
14.0
12.O
10.0
8.0
6.0OPERATING INSTRUCTIONS
Adclean 64 can be held in steel, stainless steel,
plastic or glass. lmmerse parts for 3 to 5 minutes
followed by vigorous rinsing. The temperature of
the bath should be maintained between 'l 60o and
1 80" F.
SAFETY DATA
Adclean 6A is a strong alkali and should be used in
accordance with good safety practices. Face shield,
apron, gloves and other protective equipment
should be worn.TTTRATION PROCEDURE
Items needed:
'l% phenolphthalein indicator
0.'l N sulfuric or hydrochloric Acid
10 ml pipette
250-500 ml flask
PACKAGING
5 gallon pails
55 gallon drums
REV. 9-81
TECHNICAL DATA SHEET
PEROXY ETCH 63
There's always a Chemline solution
E
A NEW, REGENERABLE, STABILIZED
SU LFU RIC/PEROXI DE ETCHING SYSTETVI
o Economical - A fraction of the c_ost of
ammonium persulfate
o Repeatable - Etch rates are consistent
o Ecological - Eliminates waste disposal
problems.
o Practical - Easy to use & control.
SOLUTION MAKE.UP:
Water(Deionized) .. .....82.5Tobyvolume
Sulf uric Acid (Technical or reagent grade) . .11.lYo
by volume
Peroxy Etch 63 . . . .6.5Yo by volume'Temperature..... ....110'-115'F'Time. ltoSminutes
Make-Up Procedure:
1. Charge tank with Dl water.
2. Slowly add sulfuric while stirring. Bath
temperature may reach .l 35" to 140"F.
3. Allow bath to cool to 't15".
4. Add Peroxy Etch 63 while stirring.
Nole: lf tank or heater is stainless steel add 2
ounces per gallon of copper sulfate after
step #2. This will inhibit solution against
attack on stainless steel.
'Temperature and exposure times are dependent
upon the required etch rate. Ref er to graph
number 1 for specif ic operating requirements.
EQUIPMENT:
Tank.Reinforced fibre glass,polyethylene,
polypropylene or
slainless steel.
lmmersion Heater
Coil Heater
Pump
Metering
Piping
Valves
Racks, Baskets
Quartz or 300 series
stainless steel.
Teflon or 316 lype "L"
stainless steel.
300 series stainless
steel, Durion, plastic or
plastic lined.
300 series stainless
steel with diaphragms,
check baf f les, etc.,made of Teflon,
Hypalon, Vitron or
equivalent material.
PVDC, 300 series
stainless steel, or rein.
forced f ibre glass.
PVDC, 300 seriesstainless steel,
f ibreglass or Durion.
polyethylene,polypropylene,
plastisol coated steel,
300 series stainless
steel.
BATH CONTROL & MAINTENANCE:
PEROXY ETCH 63 solutions can be conlrolled and
maintained for optimum performance by several
methods: work load, titration, specif ic gravity and
certain operating characteristics. Titration and
specific gravity will generally provide the most
reliable method of bath control and mainlenance.
Balh Conlrol - PEROXY ETCH 63 by titration
l. Procedure:
1. Pipette a 1.0 ml sample of bath into a 500 ml
Erlenmeyer f lask containing 200-250 mls
distilled or Dl water.
2. Add 3 mls sulluric acid and mix.
3. Add 5-6 drops Ferroin indicator.
4. Titrate with standard 0.'l N ceric ammonium
sulfate solution f rom an orange-red to a pale
blue end point.
5. Calculations:
Divide the mls of ceric sulfate solution used
by 16.5 to obtain percent PEROXY ETCH 63
in bath. Example: ceric sulf ate solution used
= 12.7 mls. Percent PEROXY ETCH 63 in
bath = 12.7 + 16.5 =77.0o/o.
Note: Fresh bath contains 6.5% PEROXY ETCH
by volume. lt is recommended that the bath
be kept at 65 to 100% of the original
strength at all times.
ll. Reagents
.l . Ferroin lndicator: Dissolve 1.285 gms 1,10
-Phenanthroline and 0.695 gms f errous
sulfate heptahydrate in 100 mls distilled or
Dl waler.
2. 0.1N Ceric Sulfate solution: Dissolve 63.25
gms ceric ammonium sulfate dihydrate in
600 mls distilled or Dl water containing 30
mls sulfuric acid. Filter if turbid. Dilute to
exactly 1 liter in a volumetric f lask.
Bath Control: Sulluric Acid Content by Titration.
1. Pipette 5 mls bath sample into a 250 ml beaker
or Erlenmeyer Ilask containing 75-100 mls Dl
water.
2. Add 2-3 drops methyl orange indicator.
3. Titrate with 1N NaOH solution to a yellow end
point. When copper sulfate is present in solu-
tion the end point will be yellow-green.
Calculations:
Sulfuric acid, o/o by volume (66'Be) - mls
NaOH used x .58.
Bath Control: Specilic Gravity
Specific gravity establishes two important
elements of control sulfuric acid and copper
sulfate content. Graph number 4 provides essen-tial information for controlling solutions of
PEROXY ETCH 63 by specif ic gravity.
Bath Control: Square Footage
Work load is a supplemenlal method of con-
trolling solutions ol PEROXY ETCH 63. lt shoutd
be used as a complete substitute for titration or
specific gravity. Square footage processed
through the bath should be recorded and
replenishment made on lhe basis of one gallon of
PEROXY ETCH 63 for each 2400 and 2800 square
feel of laminate processed. Sulfuric acid should
be added as a ratio of the pEROXy ETCH 63. For
each gallon of PEROXY ETCH 63, add .7 gallons of
sulfuric acid.
COPPER RECLAMATION:
When the copper sulfate content of the bath
reaches approximately 32 ounces per gallon as
determined f rom the specif ic gravity chart,
transfer the solution to a holding tank. By titra-
tion, determine the sulf uric acid content. Add the
necessary amount oi sulfuric acid to bring the
bath to |1oh by volume. Allow the bath to cool to
room temperature. The copper sulfate will
crystalize and precipitate. The bath can then be
decanted back into the processing tank. TitrateIor PEROXY ETCH 63, make the necessary
acljustments and the bath is then ready for re-use.
OPERATTONAL PROCEDU RES:
I Through Hole Plating
When used in the prescribed manner PEROXY
ETCH 63 will provide smut free uniformly
etched surfaces which are highly receptive to
electroless copper deposition. The number of
processing steps is also reduced. The following
is recommended:
1. Preclean in Adclean 6A
2. Dl or tap water rinse
3. PEROXY ETCH 63
4. Dl or tap water rinse
5. Hydrochloric Acid
6. Adion Catalyst 550
7. Dl rinse
8. Accelerator AC3
9. Dl rinse
10. Copperdep 400,420 or 707
11. Dl rinse
ll Multi Layer Applicaton
PEROXY ETCH 63 offers several major benef its
in the processing of multi layer circuit boards.
Unlike ammonium persulfate, PEROXY ETCH
63 exhibits far less activity on oxide coatings
on inner layers. PEROXY ETCH 63 plus a salted
catalyst system such as Adion Catalyst 550 will
contribute signif icantly toward the elimination
of "haloing".
PEROXY ETCH 63 will have no adverse effect
on phenolic or epoxy laminates nor will the
metallic stabilizers within the f ibre glass itself
degrade PEROXY ETCH solutions.
The same cycle f or THP boards applies to multi
layer processing.
lll Prior to Resist Applicaton
The use ol PEROXY ETCH 63 prior to silk
screening or dry film larnination will increase
the physical bond between the copper surface
and resist resulting in better plating definition.
A suitable process is as follows:
1. Alkaline preclean with Adclean 64
2. Water rinse
3. Acid preclean with Acid Cleaner #5
4. Water rinse
5. PEROXY ETCH 63
6. Water rinse
7. Apply resisl
lV Prior to Pattern or Tab Plating
The oxidizing qualities of PEROXY ETCH 63
assure clean plateable surfaces. Any organic
contaminants from cleaners or rinses will be
oxidized by PEROXY ETCH 63. The same
applies to residual solder prior to tab plating.
Trace amounts of solder or organic matter will
be removed by PEBOXY ETCH 63.
The procedure recommended in thispreceeding seclion can be utilized for this
application.
31
rso"r
l{r'r
r 30'F
120'F
I lo"F
l6'r
90"f
80't
10'f
Etch Rate
As A Factor Of Temperature
At A Constant Time Of One Minute
I
I
I
23 50 ts tm t25
MICRO INCHES PER SOUARE INCH
150
Etch Rate
As A Factor Of Time
At A Constant Temperature Of 110"F
I
I
Etch Rates
With Varying Amounts Of Peroxy Etch 63
At One Minute And 110'F
100
95
90
-85
o
i! 80
oEu75A
;t
?0
65
60
5S
.]o ffr to 50
llo ltt tta 122 126
MICRO INCHES PER SOUANE INCH
Specific Gravity Chart
For Determining
Copper Sullate Content
42
oU
F)
=E
il
lb
UF
L
J JI
o
U
c20oo
o
zt6oJ
o .,tU
UOxz
fo
I10 lrtt 150
o
//
o\
MICRO INCHES PER SOUARE INCH
t00
SPECIFIC GRAVITY AT 1IO"F
t30 t34
I
o
-"'l
I
ACCELERATOR AC3
TECHNICAL DATA SHEETMLINE
There's always a Chemline solution
DESCRIPTION:
Accelerator AC3 is a supplemental bath, following
catalyst, offering the following benefits:
't . Activates the catalyzed surface to increase
deposition rate.
2. Prevents conlamination of electroless copper
by eliminating drag-in from catalyst.
3. Can be used as holding bath for catalyzed
boards.
4. lncreases adhesion of electroless copper to
substrate.
OPERATING INSTRUCTIONS:
After boards are catalyzed and rins'ed, immerse in
Accelerator AC3 for 3-10 minutes at room tempera-
ture. Follow by vigorous rinsing. Boards are now
ready for electroless copper.
SAFETY PRECAUTIONS:
Follow normal precautions for acid chemicals.
NOTE: Continuous contact with skin should be
avoided. ln case of contact with eyes, flush with
water for 15 minutes and contact a physician.
MAKE.UP:
Accelerator AC3 is supplied as a liquid concentrate.
Bath is made up of : 1 part Accelerator AC3; 5 parts
deionized water.
STORAGE:
Store in a cool, dry area. Shell life is 1 year
MIXING INSTRUCTIONS:
Bath to be made up in same type plastic tank as elec-
troless copper, per the above make-up.
ORDERING INFORMATION:
Acceleralor AC3 is supplied in 5 gallon
polyethylene containers and 55 gallon poly lined
fiber drums.
REV 9.81
ADION GATALYST 55O
NE TECHNICAL DATA SHEET
There's always a Chemline solution
DESCRIPTION
Adion Catalyst 550 is a one-step true solution,
catalyst for Electroless metal deposition on non-
conductors. lt is supplied as a concentrate at 16
times the recommended bath concentration. The
concentrate is used both for bath make-up and re-
plenishment.
BATH MAKEUP
1. Add 10 parts of distilled or deionized water to a
clean tank which has been properly leached.
2. Add 5 parts reagent grade 370/o hydrochloric acid
and stir well.
3. Add 't part Adion Catalyst 550 Concentrale and
stir gently.
Avoicl stirring air into the solution in Step 3, as this
will reduce the life of the catalyst. Mix only in the
order shown. Do not add Adion Catalyst 550 directly
to water.
PREPARATION OF WORK FOR ADION
CATALYST 550
A. Work should be properly cleaned and condi-
tioned before catalyzing in Adion Catalyst 550.
B. A solution of dilute hydrochloric acid, 1 part
reagent grade 370/o hydrochloric acid and 2 parts
distilled or deionized water should be used as a
predip to protect the Adion Catalyst 550 solution
from drag in of contaminants or dilution.
BATH OPERATION
A. Temperature - The catalyst bath should be
operated at room temperature (60-100" F).
B. Time - Agitate work to release air bubbles in the
holes. Continue immerslon for an additional 3-7
minutes.
C. After seeding, parts should first be rinsed
thoroughly lor 2-4 minutes in running water, and
then immersed in ADION accelerator AC3 before
electroless Plating.
BATH MAINTENANCE
A. Filtratlon - Occasional filtration with a 1-10
micron polypropylene filter is recommended to
remove detrimental foreign matter.
B. Storage - The ADION CATALYST 550 working
solution should be covered when not in use, and
if used inf requently, a f loating cover is advisable.
C. Maintain level with dilute hydrochloric acid (two
parts deionized water; one part reagent grade
hydrochloric acid).
EQUIPMENT
A. Tanks - Polyethylene, polypropylene, Lucite,
glass, or PVC may be used.
B. Flacks - Use stainless steel, tantalum or suitable
plastics such as Acrylic or general purpose
plasticol which is abraded.
A coated stainless steel shaft and propeller or a
plastic paddle may be used in bath makeup.
REPLENISHMENT
Solution control is accomplished easily and quickly
by following the instructions supplied in
CHEMLINER VoI. I, ISSUE 118.
SALT CATALYST
Adion Catalyst 550 is completely compatible with
the new salt type catalyst operations. Makeup,
control and replenishment instructions may be
obtained from CHEMLINE technical personnel or
the appropriate technical data sheet.
SAFE HANDLING
Take all precautions as in handling hydrochloric
acid. Wear safety glasses, gloves and protective
clothing.
The above rnlormation is based on our experience and is, to
the best of our knowledge, true and accurate. However,
since the exact conditions and methods of use ol the
descnbed products are beyond our control. both the inlor-
mation and the products are olfered without guarantee or
warranty with regard to their use. Nothing in the above
rnf ormation shall be construed as a recommendation to use
the described producls in violation of any patent rrghts.
REV. 9-81
SALT CATALYST PROCESS
PREDIP 555 AND PREDIP 555 SALT
E
INDUSTRIES
CATALYST MAKE.UP
TECHNICAL DATA SHEET
There's always a Chemline solution
The Predip 555 Salt Catalyst process is comprised of
two parts and is designed to provide a highly active
catalytic surface on suitable subtrates in order to pro-
mote subsequent electroless copper deposition. The
f irst part of the syslem is the Predlp 555 solution which
functions both as a conditioner for proper acceptance
of the catalyst and as a replenishing drag-in solution for
maintenance of the catalyst. The second part of the
system is the Predlp 555 Salt Catalyst solution com-
prised of the Predip 555 and the palladium chloride
Catalyst 550 concentrate.
Used for the make-up of both the Predip 555 solution
and the Predip 555 Salt Catalyst solution, the Predip 555
salt has special additives which inhibit attack on copper
foil and prevent displacement reactions with flame
retardents which can cause activating and plating prob'
tems turther down the P-T-H line. Attack on black oxide
inner layers is also eliminated.
MATERIALS REQUIRED
l. PrediP 555 solutlon:
The Predip 555 Salt is supplied in 100 # containers and is
used at a concentration ol 2#,4 oz.lgal.(270 g/l). No other
additives, except deionlzed water, are required' The
Predip 555 solution is used immediately preceding the
Predip 555 Salt CatalYst tank.
ll. Predip 555 Salt Calalyst:
The Predip 555 powder is used in combination with
Catalyst 550 concentrate and deionized water to prepare
the working Predip 555 Salt Catalyst. (The Catalyst 550
concentrate must nol be added until the Predip 555 salts
are f irst completely dissolved in water!)
SOLUTION MAKE.UP COMPOSITION
l. Predip 555 solution:
_C_on!olgn!Make-up Conc.
'Note: When operating the bath wlthln the temperature
range of 95" - 100'F, it is important that the catalyst 550
concentrate be analyzed on a routine basis.
SOLUTION PREPARATION
!. Prs{!p.Q!! solutlon:
Fill tank to approximalely 70oh of tinal volume with
deionized water ( 1 megohm resitivity). To the water,
add the required amount of Predip 555 stirring until com-
pletely dissolved. Bring volume to 100% with deionized
water. The predip is ready to be used at room
temperature.
ll. Predip 555 Salt Catalyst:
Fill the tank with the entire volume of deionized water
requlred ( 'l megohm resistivlty). To the water add the
required amount of Predip 555, stirring until completely
dissolved. Only then is the Catalyst 550 mixed in slowly.
(lmportant: do not add Catalyst 550 directly to water
alone.) Avoid stirring air into the solution while mixing
the Catalyst 550 concentrate as this will reduce the
operating life of the catalyst.
OPERATING CONDITIONS
l. Predip 555 solution:
A. Temperature . The predip should be maintained at a
range of 60'F - 85"F.
B. Time-2-5 minutes immersion with enough agltation
to clear conditioned holes.
C. Tank may be covered when not in use.
ll. Predlp 555 Salt Catalyst:
A. Temperature - The Catalyst should be maintained at
a range ol 60"F-85'F.
B. Time - 2-5 minutes immersion with enough agitation
to clear conditioned holes.
C. Tank may be covered when not in use.
REV. 9-81
Predip 555 powder
Deionized Water
2#,4 ozJgal.
Q.S. to operating vol
ll. Predip 555 Salt Cata lyst:
Component Make.up Conc.
Predip 555 powder 2#, 4 oz.lgal.
Catalyst 550
A. Room temp. operation-6.25o/o by volume
B. 75" - 100'F operation'3.1% by volume
Deionized Water Q.S. to operating vol.
Predip 555 and 555 Salt Ca talvst:
Tanks Polypropylene, polyethylene, ceramic, PVC.
Note: Tanks should be thoroughly cleaned and leached
prior to use.
Heaters . Quartz, teflon.
Filtratlon - Occasional liltretion with a 1'10 micron
polypropylene would cartridge f ilter is recommended to
remove detrimental foreign matter.
Tank Mixing - A coated stainless steel shaft and pro-
peller, or a plastic paddle may be used in bath make'up.
Tank Storage .The Predip 555 Salt Catalyst bath should
be covered, using suitable material, when not in use' A
floating cover is Preferred.
BATH MAINTENANCE
Both the Predip 555 and Predip 555 Salt Catalyst baths
may be controlled by analysis using the enclosed
anatytical procedures. lt is strongly recommended that
the Catalyst 550 concentration be controlled by atomic
absorption sPectroscoPY.
tn order to maintain Predip 555 solution, a dynel bag
with the salt concentrate should be placed in working
solution and kept full daily. A pH of 0.75 or less is
advised.
Copper concentration in the predip should be kept
below 0.5 g/l as copper metal. lt should be replaced
when the copper level reaches this level. A Chemline
technical representative should be consulted for
analytical techniques regarding proper concentration In
Predip 555.
ln absence of routine analysis, the Predip 555 bath
should be replaced once a week'
ANALYSIS OF PREDIP 555 & PREDIP 555
SALT CATALYST
!.lcqlPqg"!-Bggc!gq'
4. Pipet 10 ml of the diluted sample into a 250 ml
erlenmeyer f lask.
5. Add 50 ml distilled water and approximately 2 drops
phenolphthalein indicator. Mix.
6. Titrate with 0.100N NaOH to pink end point. Record
the number of milliliters of titration.
Calculations lor Acid Normalily:
Acid Normality = ml NaOH titrated
5
Note: A. Predip 555: Maintain normality between 0.25N
-0.35 N.
B. Predip 555 Salt Catalyst: Maintain normalily
between 1.0N - 1.4N.
(Rarely is an acid addition necessary. Always deter-
mine and replenish the bath f irst on the basis of the
Chloride Normality Analysis (below); acidity will
increase with the addition of the Predip 555 salts.
Then re-check the acid content and make additions il
required. An addition of 17 ml/l of concentrated,
reagent grade Hydrochloric Acid will raise the acid
normality by 0.20N).
7. Add to the solution of step 6, 3 drops Sodium
Chromate I ndicator Solution.
8. Titrate with 0.100N Silver Nitrate, AgNOs, to a
reddish-tan end point. Record the number of
milliliters of titration.
Calcula tions lor Chloride Normality:
Chloride Normality = ml AgNOr titrated
5
Note: A. Predip 555: Maintain normality between 2.75N
-3.75 N.
B. Predip 555 Salt Catalyst: Maintain normality
between 3.5N - 4.5N.
An addition of 2.0 ozlgal (15 g/l) of Predip 555 will raise
the Chloride Normality by 0.22N.
SAFE HANDLING
1 each
1 each
1 each
1 each
1 each
2 each
5 ml volumetric PiPet
100 ml volumetric flask
eyedropper
10 ml volumetric PiPet
250 ml erlenmeYer flask
50 ml burets
ll. Roagen ts Required:
Hydrogen Peroxide (35%)
0.'100N NaOH
Phenolphthalein lndicator
0.100N AgNO3
Sodium Chromate lndicator
lll. Procedure:
1. Pipet 5 ml of the Predip 555 or Predip 555 Salt
Catalyst working solution into a 100 ml volumetric
f I ask.
2. To the Predip 555 Salt Catalyst solution, add approx'
imately 8 drops of llzOz (35%). The solution should
turn amber; if not, add additional hydrogen p*roxide'
Omit the above HzOz (35%) additon vrhen analyzing
the PrediP 555 solution.
3. Fill the 100 ml volumetric f lask to volume with dis'
tilled watsr. Mix well.
The suppiier makes no warranty of any kind, expressly
or implied, concerning this product or its use. The user
assumes all risk of use and handling regardless of
whether the same is in accordance with the direction of
the supplier.
..please refer to volume 1, issue 118 of the "Chemliner" lor methods of determining the stannous chloride
"onl"nt by titration and ihe palladium chloride content by visual color comparison standards'
EQUIPMENT
e
Catalyst 550 concentrate is a strong acid. Take all
precautions as in handling hydrochloric acid. Wear acid
resistant goggles, gloves, and clothing when handling.
Avoid contact with eyes and skin. ln case of conlact,
f lush exposed areas at least 15 minutes with water and,
if necessary, consult a Physician.
WASTE DISPOSAL
The Predip 555 and Predip 555 Salt Catalyst solutions
should be adiusted with sodium hydroxide to a pH of 7
+ 1 @ 75'F. They should be filtered and discarded. The
tiltered sludge should be treated as metallic waste.
Local regulations should be observed when discarding
effluent liquid.
WARRANTY
('
ELEGTROTESS GOPPER 7Ol8
IN E
ES
Copper Both
TECHNICAL DATA SHEET
There's always a Chemline solution
Bath Description
CHEMLINE'S ELECTROLESS COPPER 708 Copper Eath
is designed to deposit a bright, dense. coherent copper film
on conductive and catalyzed non-conductive surfaces.
ELECTROLESS COPPER 708 Copper Bath has long life
and excellent stability and is very easily controlled over a
broad operating range.
Bath Makeup
The bath is made up from two concentrates as follows
Deionized Water 80% by volume
ELECTROLESS COPPER 708 A 10% by volume
ELECTROLESS COPPER 708 B 109/, by volume
The components should be added slowly and mixed tho-
roughly in the order given.
Bath Operation
A. Equipment
1. Tank - rigid PVC, CPVC, Polypropylene or
2. Agitation
gl ass.
- constant solution aeration with clean
d , oil-f ree air is necessary to ma nta tn
an on
which will gently give uniform distri-
bution of solution through the holes
is also recommended.
- if used, it should be a water-jacketed
tank or a non-metallic heat exchanger.
- they should be 316 stainless steel or
a suitable plastic. They should be free
rinsing and distribute the work load
evenly throughout the bath.
3. Loading
Up to 3.0 square feet of srJrface area per gallon
of bath solution.
4. Filtration
Periodic filtering through a 10 micron filter to' remove particles... dust. and other contaminants
is recommended.
5. Plating Rate
The bath will deposit a copper film thickness of
about 20 microinches at 75o F. in 15 minutes.
Plating rate will drop off sharply after 20 minutes
immersiorr time.
Bath Maintenance
The bath may be replenished based upon copper concentra-
tion. All replenishments made should be in the following
order:
Add Concentrate A slowly, mixing well
Add Concentrate B slowly, mixing well
The necessary analysis procedures required by each particu-
lar installation will be supplied by CHEMLINE. Laboratory
equipment for each analysis is generally supplied by the
user or may be purchased from CHEMLINE.
Referring to the copper analysis sheet, determine the cop-
per concentration of the bath. Using Table I or Table ll,
obtain the proper addition to be made.
TABLE I
Additions for every 10 gallons
of ELECTBOLESS COPPER 708
4
Heater
Racks
B. Operating Conditions
1. Temperature
Preferred
Permissible
750 F
650 F -850 F
Copper Concentration
90%
BjYo
70%
60%
50%
A
ozslmls
1 3/390
261780
39/ 1 170
52l1 560
65/1 950
B
ozslmls
1 3/390
26/780
39/ 1170
52l 1560
65/ 1 9502. Bath Concentration
Preferred 75Yo - 100% makeup concentration
Permissible 509/" - 11096 makeup concentration Bev. 1-83
DON'T FORGET BAILOUT!
Overnight Shutdowns
1. For overnight or weekend storage, it is advisable to
have the bath at or below 7O% of the original makeup
concentration.
2. Air agitation of the solution should continue.
Restarting the bath -
1. A copper analysis should be performed'
2. Additions of Premixes A & B should be made based
upon the copper analysis according to the normal ad-
dition schedule. (See Table I or Table ll.)
Tank Conditioning
1. lt should be a regular practice to periodically leach
the electroless copper tanks. As the result of abrasive
contact of catalyzed circuit boards with the interior
tank walls, copper will begin depositing in these sen'
sitized areas and eventually result in excessive copper
deposits causing bath instability. Once aweek orafter
an extended period of dormancy, leach the electroless
copper tank with Peroxy Etch 63 or ammonium
persulfate. Follow with a thorough rvater rinse. lf
persulfate is used for leaching, a 10% sulfuric rinse is
recommended followed again by a thorough water
ri nse.
2. Any time that the bath is transferred. either for stor-
age or tank cleaning, the bath should be filtered. A
filtering device and filter (10 micron pore size) with
low absorption properties such as a polypropylene
filter and a non metallic filter pump are helpful to
remove small catalytic particles that abrade off the
work.
Waste Treatment
Basically, an electroless copper bath contains two compo-
nents which must be waste treated before disposal. These
arethecoppersaltandthecausticsoda,Thecoppersaltis
most effectively and economically removed by precipita-
ting metallic copper from the solution. The remaining .
solution is then neutralized with acid and is disposed of. . ,
For specific instructions see the separate .sheet entitled " .,,
"Waste Treatmgnt of Eleitroless CoppelEatlii".:' r.,, .. :
'' j i\. .'':,'
Safe Handling
Electrolesss 708 Premi>1 A contains formaldehyde and
copper salts. Premix B and the bath itself should be handled
as alkaline material. First aid in all cases should include
flushing all affected areas with copious amounts of water.
For further information refer to the OSHA 20 forms' ln
any event the use of safety goggles, gloves, and protective
clothing is highly recommended when working with any
of these chemicals.
WARRAI{TY
The above information is based on our experience and
is, to the best of our knowledge, true and accurate.
However, since the exact conditions and methods of
use of the described products are beyond our control,
both the information and the products are offered
without guarantee or warranty with regard to their
use. Nothing in the above information shall be con-
strued as a recommendation to use the described
products in violation of any patent rights.
TABLE II
Additions for every 100 liters
of ELECTROLESS COPPER 708
Copper Concentration
90%
8O9/o
70%
6ff/o
507o .r
A/mls
1,000
2,000
3,000
4,000
5,000
B/mls
1,000
2,000
3,000
4,000
5,000
6CS
AITERICAN CIRCUIT SUPPLY
116S0 SW BABNES BOAD
PORTLAND, OREGON 97225
u+7100
(206) 881-7495
l
.\<itl (.lcant'r a5 fills att inrport:tttt voitl in tht'
1-rrt'lrlrlutir-lrr ol lrtirtted circuit bo:trtls priot tot'lc<'-
tloplrrting. It relrlac'es hat'str alkalics atrtl abrasivc
r lt'lrrrt'r's u'hir:lt cittr clesttt.rl' the intcgritv ol tht'
s, tct'lrcrl or lrlt<ltographir: inraqr' ()n clcctr()l('ss
( ( )l)l)('r ()r'c()l)lx'r' larnirt:ttt'. (larrsti< lrraterials rn:rv
r lrrrst' lrinholitr.g and t'csttlt irt t'csisI bre:rkdorvrr
tlLrr irrg plating lvhile abt'asive scrrrb clean('r's \vc:tr
tlrt rcsist thin anrl cutt ttslrlt irt nodrrlcs ()n tll('
srtt l:tt t'.
;lpplir:ation Data:
Soct'rrt'tl antl tlrl' {ilrtr <-o:ttt'cl b<lattls c'att bc sa[t'11'
irrrrrrcrsctl itt soluti<xrs ol Acitl (ilcaner *ir jtrst
1rr ior to t'lt'r'ttoplitting.'I'ltotrlrrgh clt';rning rtilI
lrt' lrr r orrrlrlisltt'tl u,ithotrt tlt'gr;rding thc lrlatirrg
rt'rist.
'l'lrt' IoIIou'in13 1rt ot'eclttrc is t't'<'orrtrttrtttled:
.Str'p ; I: Solrk t lt'art itt a 10"6 to ?0'lo soltrtiort ol
,\r itl (,lt'anct' F5 lor I to ? rnintrtt's lrt
r'(r(rn t('illlx'lirtur('()l ir('irt('(l trlr to I l0"l;.
.\rr'1r ;'): Rinst' <rrrrrlrlt'tt'lf itt lttt ovt't'flon'irttl
\\'al('r'tirtse, [ollon,r'tl bY u I)l sllun'or
irrrrrrt'r'siort t inst'. Ritts(' l()t' at lt'irst 30
st'r ot ttls.
(.orrtlol:
,\t itl (,lt'arrt't pir is rl ( ()t)c('lrtllttt' arttl srrtall
lrtltl i t ior rs rri I I I t'r'i talizt' ;r brr th. .Solttt ion stl ('r)!{tlr
.r r r. l lrtkl i t i<)nri ( lrt ltt'st l.rt' tlt'tcnrtittt'tl lrv ti trat ion.
Sal c t v Irrfornrati<lIr:
I'ro1rt'r I)11'(ituti()rls sltottltl ltt t'xt'tcist'cl u'ltt'tt
lr;rrrrllirrq ,\r irl (llt'rrrrcr'#ir. r\r'oirl ( ()ntil('t rvitlr tlrt'
skirr. II slrluslrt'rl in tltrt'r't's tirtst'tltororrghlt rritlr
rr'lr lt'r lr rrr I g,('l I)l ()ttrl)t rttt'tl ir'lrl ilt l('ll I i()t'r.
ACID CLEANER #5
CHIMLIffi Industries
,,\< id Cleaner t5 is a frcer rinsing rnareria], too.'I Irc possitrilitv of contanrination to strbseqlrenr
blrths is drasticalll,reduced. It contains no sulfuric
or hvrlrrr<:lrklric acicl. It is a urritlrre blend of or-
glrni<' ar:i<ls plrrs a('tivat()rs rvhi<-h r+'ill rapiclly
f)('lretlatc :trr<l rc,ln<>r'e t1'ltical 1>roduction soils,
irrr ltrtlirr.q Iirrgcr lrr int stains.
Stt'p *3; A. Pr ior to py,rophosphatc copper, usc a
I0?,6 Il(ll-.solution a[ r(x)m rernlxrarur€
for I to3nrinutcs.
B. Prior to acid copp('r usc a l07o srrlfuric
at'id solrrti<)n at ro()rn terrrperatrrre for
I to lJ ltrirrrrtr,s.
Stcp #4: DI rvatt'r' rirrst, [irr'30 ser:<tnds.
\\'lrcn lrcavit'r thcrr rrrlrrrral soils:lre l)res('nt, ir
rrrotlt'ratc lrlkirliut' cl(,;lr)(,r strh as Adclean #6A
( iill llu.Brn('llt tlrt' < lc;rrrine afliricncl, O[ r\cid
(.lr,ant'r #i. ,\Ik:rIirrt, < k'rrnin.q can cithcr ;rre<'ede
ot lollorv a< itl < lt'lrnirrg.
,\r'itl (llcarrt'r' Fir r trn also be trsed to clcan rrickcl,
qolcl artcl silvt'r .
I'ackaginq:
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I h-tech plHig
By Mark A,
oahhAqfilh
SAN JOSE, Crllt. - Whttc lNtrttlq I nct ltorstc trnl
nerr tha Fsltchlld Crmcrr rnd Inttrum.ot CorP.
.emlmnductor ihnt hcm, coauEuctlon torlerl wcrt
. w.d to t8 :hc rlch, bhcl totl ol ti! l.rlile Srtrtr
.hn Vrllcy llv! lry b I lot&, mllly, Dst{elorcd
rnucl.
Frirchlld, too, rrt rtunncd. So icru ltrtt PoUution ol'
tlcl.b. And poPh llviDt sarbr.
ltr oil. ticr-rll F0 dirovtrad, hrd !.sl ditcllorld
by 51,@ lrlliro of torlc chrmlcrl slY.rtt thrt had
lirlcd kom rnothcr tlort3a trnl urb, - ud crecaed
inlo thc drlnlhs rrt r ol t!.9t!.ll!t, mlddb.htt coB
muitY rcBt lhe ilrct.
I'he[ fhd, in Novcmbcr 1961, t$ lic tiBl rYidemc thrl
Oc renomed el*tronlc! ptrntt oI ti! SillM Vlllcy hrd
r pollutron prcblam, I problcm rrlour mqh lc o
dair3er tlre very orchrrdt. bsrini ttrctt - lrd PcoPIc -
ants create pollution problemsr too
rmong whlch thG lrclorlo rm rprcrd, : cNci thry DrlDt mlnhturlred ctrcuttr, Cbcnlol tolv.olt 9[l9.L [r..q1,:.,I lldlltlt b ln Aritlsr, tr- i-h;p,.bi;, il ;i.*itaco to'ttrii-Sea frrnc6r ary 1.[ ;-fit..p *;fr1r ;t..4 H;t ,a.tr .ra ' dutrlct Ervla3 hltHtc!. qoFda -.rl*ltopltt'n
. g.a, tiore.r. Comunigs rcrou-tbi crutry rn aii i.iat-- fupfoy.O ta .lctroght rmo irtr. i :^ md Dl8tuo cmD.olg rd tb tllr - d( era otc io
covcrinl thrt computE{hlp mrl.d rnd othc! hlgh- )r HcmhlD.SrntrOrravdlay,tlarrctatypd"Sulca ,.. ut€-tolll..
ttrhmlorymDrnl6-ometdmp€tcdbyuvlImee vrUcy" ruccs-itory, C.Uiihiihrttt oiiictrtr bvi Ma$rchurttt, rrrol[cr hlit'ttch hrva, tu mticrd
;i;;;;;Glil-ffid'; o'. ri uutia*.' tll.y ,u " i-rtr*"i* ortnitnj rrtn, ' . ;, prni$ ttMt .lont Hi0f,rv.lrt.D.rr Bsbo. "wrhrvc I
',you oft6'thlnl ol thcm tr clern lndurlrier becrurc - ilu "rrf"fift.ppi.ud
Oi [rdutry lor movlnj nll0y :JV' aondderable Probl.m bcE," uld ooc tt t aShcr'
ino-jon;t',*-u"t.t'in6rmolestrckroirnyrhingrhat fo*,i"pti;iprf:ii,urit!G,-"r.atttrc"iOcitrl+tui,r !!tlrrhrt.beppeoedtcnlaltrrSilimVrlley.
routd vlrurlly ottend
-you,"
saiU FrU Wtrtii.s 'or Uc iii i,iiLti.tfiii3t t-dtortctutr prOlsa. Tigr i i ln Srcnm.nto, Crl[., Actlj.t Gtaurl CorP.' r ru,lor
Clftiori.Ei"rtr*t'otttettlscrvicer.i'Buttlryu* ;i;['thcquutlm.irfiiOOor|t!rfcptcatUutuO r d.l.N. cotncbt thrt meauhctw tuidtd Bl$ut
.ff .rt of ri.y toric .nd drngcrot chcmlcrlr." ' poi*i,o,,l riit ti.irr. .i rgtUcO, lur ui rX rrut- . . comFocilt, h$ f:m r*t d bY tbr tltt o( dmPit{ lt-ifotmficf,.,irc"tr,butheafooutgasa,too,rndbo6 'riuiri,f lrA.Uctmrautrcturia3groccrn. '1'..'q,d.14,m.{{lTtollodctut rlvcottintoudincd
of'rf,.ic *t.ii.ii I rmc rpikcdiittr'.quilty toric 'Til;;i[,-ti.,4C,.r"iOtttclttObeadru t... pitr.c.qo&yjDrlnllnt-trtaftlblDtlrrrc.hrv.ba!
tterry ,etatl - tuv: touna tUeti try tao tlc roit, lr*il t"ir. "ui.t tlim mAUoi,ef, Uery Uantlia. 1 contemlnrtcd liu ruryclcd cuclmlcit lt llwb u9.to
water rnd air. Ttc prcc-l* volumc ot hedrdoitute 3cncntd by llo. tlmct ttorc cooridcrcd t l. b, .trt. hcrltl
Hrgh.t(h indultnet se hrardour mrtcrislt itr r high.t ch cffiprnlq lt untmm, bst UD.lYmil, d; t lutiorlu4' variaty of wryt. Computer{hip mlcn, lot crmple, uE Crlltornlr, Drvlr trtcrrch$t .ttlEltc ttrl tia . '
rstndand otler brii jeu t6 ctch t]c rlllm rilur m . , cl.ctrohr bdu[, rlooc dlryqcd o( 05,m bd h ' (crqlrct c P{t All)
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Tim.t. Cmllh..Or... trid.Y.23, r9l3lt0HAGKPAGE
oHigh-tech p
(Colthucd ,rom Pr8c Al)
OrGSon otficisl!, sho lok h hlSn-lch to bohts thc
saISinS lumb.r lndultry, hrvr louDd tbat thc DGr h'
duitrlei have mmc .l . pric..."Hilh{ec! lirmt, rhilc
(requently dercribed r! clem lnduttrid, [e l! ln in-
dusirirl chs one ol lh! lrrgcrt 3!D6r!on d bru rdat
saltc! in the ttrtc," sld willitm Yont, dircb[ ol th.
OreSm Departm€nt ol Wttar Regurcar.
ln ifugurt tefl,80 to 1,0fl trlloo ol r sluuo oI
hvdronuoric rnd dlric rcid - HF mlutloo - lcllcd trcm
ai undergmnd trnl rt $. H.xlltt.Ptclrrd plrnt b Cor'
vallit.
ThG slutlon tlowcd into umndlnt nll rnd 5nvel,
but rpp8rentl, dld mt ryrcrd hr lrm tir a,00 Srtlm
Unt ln which lt ult thr.d.
Dclplt. ther problcm!, hlth{cd cnrnFrl.l - coo'
Dutar mrnulactur€t!, phermrcaullcrl houid, rcrcsPrca
iimr and tlrc lil! - ltiu rrc mrtcd by rmbitlout
b8lnc$ tMpt rnd polltlclr[. Aprll Yrut ol thc Frlr'
tu, Vr., Economlc D.yclopmlot At.nc, xld thrt ol lU
o, tie suntry't {,500 d.vcloem.ot conrultmtt, "ll't lrir
to sy tlat €v.ry onc of th.m h rlttr hlth tccb."
Some arc mt rxrra ol tcliost Pollutloo Probhml,
Young rald,0th!rt b.ll!v. tuch Probl€m! rra
mauleabl.. Mct rcclpt $r potlnthl tot pollutl,or lt tbt
p.icc ons mult gay for ncw ,ob! rnd t[ rlvcnuc.
"P6ple ln or€gon, Slvcn t!. commlc tltBllo rr
luvc crperlcnccd ln thr lrtt law yurt, rru rclmmiDf
thrt hl8h.t(h tlnd ol rctlylty," rid YM3, th. orc8or
wller{uallty olliclrl rnd lormcr dlr(b! ol lh. ttrtc'r
D€partmcrt ol Envlrormentrl Qurllty.
Th8t rttltudc lurprlrc! sm! Pcopl. hhlllrr tlth hlth'
lrch companlet.
"lt't completely crrzy, tilt ruth by avaryono !o hultla
hl8h.l4h," uld Amrrdr Haw.t, r $n Jotc rttomcy tho
trcchllzet ln hwlultt rltl[t comprnlc! rccu!€d ol rPUl'
lit hazardour chemicrlt. "P@9lc rre lrlll4 rll over
thimrclver b ilvr th€te comprnlet whrt th., srnt, bui
you don't t.c rryMy ttoPplq !o r.k, 'Whlt lrr Dm! o,
thc problcm!?"'
"ll it ab$lutlly Dutt," Eld Trd SmlO, rnothcr Su
Jot. rttorney rbo hudt Ut. Slllcon Vrll.y Totlct CoU'
ton, r coll€cuon ol mvlmmahl rnd lrbor !r@Pt. "lI
pople here hrd had rny ld€r rtut Oe, serc buyint l4lo
lants create
sllowcd il.'l
"when r smt cbccl tho*! lhrl ?0 gercrnt ol thc lrntr
lat- lt't roinr h bc I Dmblcm xhcravcr tb. lnduttry
rcr," sii Pcicr Cenrit+Grutrchl ol Ur srnu Chrl
Catrrl bbor Comcll.-;;;;; crrirlnt'Csutshl r3rcd tlti lhckonio
ri'urr.' *i.oatt"ura iho dd ihrt tht Prrc{ctr-t[tt
tea to mrlcloolluthl prcblcmt $t Dt urcldaDlc iltD
ilh m-rii,,'.tc+ $ci uld, hevc hrrn'd Ircm lh' Bil
tat€! thev mdc haru.lif i#',ilJii tt t'tr.r," lrld Allr T F6trr ot tb'
r*rrd:i. ui6tni"t"t Atdirtioo, rn idurtrr srouP uut
ha! lormed I rDchl commltttt !o rdYh' ltt mcmb€rr
ii*'ii'",iii.rr.t[ mo rvold rrt.nvlromqul problrmt'
;:n. or.iiro'rlito* to b€tt mlnrlc thrt rttt, rnd tlrt h
*i"'.'i-[rnr ir,it lndurtrv ir miln3 irot rtrld" "-r''ltie;;;ft;thc ommintt, rny goa, otvlourly'but tt
a*ii;iii'i,i .ri r."4, cltlrer, !o Lrvc thlr mrtcrhl lul
rri"'iri. uitr*iri*ti' raid Lrrry Bortmrn' chicl ol
tscilitlet Dlrnnlnl for Intcl CorPorltlon' I ruker 0l
liiii""L'.orpoienu. "certrlnly th' mon'v tFnl l0
il,ruii*irilt i 'r"*
tr trtvhl conipucd b (rbst lt cfltt
!o) cl.rn uD I tPUl "*hi.i,ii -J.ti'i"ttrtlm h mthlrt mr' oll, chcmlcrl'
"ii-iiJ "tr,ii-tiiw uautulc. hrvr b YrrvinS dcar*r
litiii'iiriJi" rt ioi'virn' cnglncn hrv! di*orcred'*il;'d;.t;fti;if
companlir *trc ruppeed to bG dll'
Hi"lii 'fii. ciiiiiiiton Foundrtlon, r wmhlnitm-br!'d
;;ri;;il.lti;L;p, "ncc
htllcd hlth't'ch lnduttrlct rr
;r.""
"i ."r"tinrironm.ntll problcru'"
,":'i1*:l**ll*:,:iu'i*:H'd:lid'.rfi :'::',iiiiriiiriiiir"]r ;i sdnlord unl'crdtl lru hcn rod tlc
dclenr lndurtrY mrr L0 Ai8'16'- cii, ry;;;:1', gtt"'?H I *:.::li?:Tf;.1T,{f,il:
pollution problems, too
pH. tometlmd rcmrr lhc rtret tmm imo or cithh $c tPr€'d of sBmimtr' siry'r sid oth'r c{m'
. r fer hundred vrrtr ot ortnunj'i'iti;liil ilffi . prnii'.hc.rddcd' rrc Milorht th' utat o( tlcir lcrlt
tlcialt ottcn w.rc tbc illv .r,friiil.to-;i;-ti i{.:il-I lmcd lo clan thrm uD tha &t' ruch
'.*t*i.q Hr4tr,Tt,Hi#:,Tlt t*H,* i,Sfff r,S:t ffi :k,.ffi ;i:f glt[
t}! thrert ol rn crPlolvc llrc.
OKuldcrtruilt,hotar,rtlorrlatrslcrnlulltrbGmootloEdtotDedthcdb'oY!r'ol8!'mrlulr'Itc
Mr6u, otrro rt I rurp*,ru,y .iiiilti,iil"i"ii,iii Flilornrr k3lrlitun prttrd r limbr ht ruls ht
dctct.d. tor tic !'lt ol thc ltrt' dtcctlv' Ju l'
A lubEnrnao llbertlu t8nt bdind ttc Frkchlld
"scvcrrl
othrr ttrtct' tuch u Nn Ycl' Nil J*'
lcmimnducbr plrllt larca, rpprrco6tioiiiiliffi ' snd Micht$r' rl$ rcaulrE uDd'rfrald lrilr' Prlturu'rcrstrvcrr. i--*--'- -' .#i'lxf#'trxilnl,;lt'jif':x#ffiLlf,;
A lcc dryt rfttr tht lerl trt rsldent ll!'uncov.nd Dy nrh.Lih commnld h thei no olc hrt clctrl, dcliltd
thc cmttructlon crcx, Frlrchlld xrmcd tD. oEet urrl yirt mrtltutir hkh tEh. Ti. Buur ol hbtr Shtituct. WrEr Co,, rhlch o9crrt.d I blt!'volum drlill{'wrttr ir mmptttnt r lltt-ol U8b.ttch lndurkla bmd o tbt
reu l,m lmt lrm tbt tld. . . . .. - tmoni ot ripmy sport oi racrnb ud &ectryMl. ht
It rrt too ht . TaE tlottd tirt lhc ICU rrl.cc i"i-i motctl.A'n.
hmlnrt.d vlth unlrrlully blSh lcv.lr ol ciqtrlcll 5l' - i;;.;. bnc burcru ottlclrl dd hlth.t c! hdutrtct
v€nt!,lmludlq_t,l,ltrlciloro.th8lr.O!Dc.?,lEl,t!. f""r.ifi'.n cflld.r.d h lnclu(b thc r1r.f{, of
iell ru slcd. itrronic ommalt. m.dhd &d ot!.r riatillc b'
'It. mbmlmtlol, rhlct tunrhd hydrclothlt rlti itmcntr. dcl&rx roDor rrrttm, phlr|Imtlcelr,
Itt rbtllty to EP thrN8h hyrn ol clry u[t rrc lln' i* rctoti rnd otlrcr rdiuri lndurtrtrl mchlncry.
pcmabla to rrtar, hrt tlne tprad h ltrI.rta mtDct Ar $r lnduilry blord[rd b tb. lit6 rd '?8, m m
Grert 0rlr r.ll 1,0fl leet rwry, rpprrcutly lrvchuch tho{ht to thr prcbhm th.y ml3it
Amthlr hrrc lerl sl trt dct6tcd rt r narby IBM ciir.
"riii.liib"t lirt. dlrcwcry ol r lrrl. dlercl lxl l:rl "Evcrybody xrt cruthl rlttr Lhdt Fntt dom," uld
ii."i'i ii, tt ito \Yhcn ri lotormil nncy by ti' Hua iNoSodycvcrbotbcrcdt!rffryrbo{ttiltttul'
' Gl*trcnlai ltrduttry tndliltc{ Orc pmblcm rrt mmm6, 1."
ttri-sra irrnctro'&y Rcglonrl lYrter Quuty control "rt.r! xu v.ry lltth comm lbout q'-old Phou
fo.J onOrcUA r ruilcy io tac hof, commotr lt trt. bcruE m one rtiurcd tic Problcm," tlld $n[.Cl$r
Ttc runcv rhovcd thri 8e cmpenlu urc undcrjrond conty plranlnt dlretor Jlcl sch@P' "Hli!'trh rl
t"nU=to rfoll rfrong plvfib. Ol ahc 00 thrt hrvr bdr ln. Jut rircl r drrlht sm9[Gd !o Ur old trnotdttcl lD
rmtcd r lrr. 0l o{ Oam, or 8o D.mt, hlYC bcen loutd dutrl6."
ii iert. lcrriv CO DGrcat ol tia tult lhrl l.rled blvc Detplt! ti. DroDlcm hcr, Schep nld hlth.t*h m'
mllutcd rrostrd rricn, tic rtudy dll(nvB'd Drnict rull do Dt lorrT Llm bcrul' b' rld, lndutlry'' rrotn-. xrlcr{urtlty polnt ol vlcr' rr blvc I v'ry ind tlc aorcmmat ln rtrr' ol th'lr du'lsltl6, ld
prlout Dotcnthl iroblcll," trld Hrrold Slryfi ol thG rro rrrn ol hol to Eluhtt thcm.
iedmt'rrEr quirlltv lorrd h odlrnd. "W. llrcsd, Othdt, hor*o, rn lull rlcptlcll'
ii'vi mUuttol ot itrc rirllor fioud rrt* brtlil, rnd uD "Yo trtc uy ru rltl a lot o, chcmlcll ultc . . . rnd
l8r ic rh rcmctlrlnt mi !o contlln l[h, lt rlu bc mly r dro, r tri monlbrtrg rcllr, rnd I plnnttc you'll rtlD
tiito ot uroc bcim ureblc imrd trl.r lr coo toitq thr otlEr trr," dd Lt' cbrrld -Rle' r
hmliltrd." hrurdour'mtrrlelr eochlbt rtti th' Sumrrh, clu ,
Boti FrltchlB lld IBM hrvc dut uD rld bulcd ltry' . llrc &prrun.ol "u bc, tton lt h thc lMrd' ,ou ln
, o"iu"t"it.d toU rd rn lutcrtnt UbUa 3rurad rrtct totnf to nld lt b thr purad - rod b th. trttr, Mil.
il thc turhcc tn I mulu-mllllotr &llrr .tt.m9t to rrHt I b(pk m lt "
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